摘要
针对大面积功率器件软钎料的失效问题,运用扫描电子显微镜(SEM)分析了SnPb软钎料的微观结构并运用能谱仪对其进行成分分析,找出了失效的主要原因:对软钎料进行刚玉抛光后,未能将残留在软钎料内的Al2O3成分完全去除,以至于器件的可焊性变差.根据分析提出了改进意见,较好地解决了SnPb软钎料的失效问题.
Aimed at the problem of fine solder in large power devices, the microstructure and components of SnPb soft solder of device are analyzed and the failure modes for polishing are documented. The failure causes are discussed： the remains of Aluminum Oxide are still in the solder and result in the deterioration of soft solder . According to the analysis, improved measures are suggested. Experiment results significantly favored the processing of SnPb soft solder in large power devices.
出处
《分析测试技术与仪器》
CAS
2008年第3期147-150,共4页
Analysis and Testing Technology and Instruments
