Ti／Cu接触反应液相层生长规律研究

Research on the Liquid Growth Mode of Ti/Cu

针对Ti／Cu接触反应界面层的形貌以及液相层的出现和生长规律进行研究。以Cu／Ti／Cu嵌入式整体结构试验件为试验对象，在连接温度为900℃，连接时间分别为3、5、7、10、12min的条件下进行瞬间液相扩散连接，研究接触熔化过程中，Ti／Cu扩散偶界面微观组织形貌的演变过程、界面反应层的出现以及生长规律。结果表明，Ti／Cu体系接触熔化阶段液相的生成存在一段孕育期，即在界面接触阶段的前2．6min内，用于元素的扩散和中间相的产生。当界面出现Ti／Cu共晶液相时，液相层的生长模式符合扩散控制的抛物线规则。

The experimental sample was constructed as sandwich structure of Cu/Ti/Cu with Ti/Cu foils in thickness for contactmelting. The processing parameters were at 900℃ for 3, 5, 7, 10, 12min for contact-melting respectively. The microstructure of the Ti/Cu interface was investigated by using Scanning Electron Microscope and the growing regulation of liquid layer was researched; The results showed that the initiation of liquid in the Ti - Cu interface also needs an incubation period, approximately 2.6rain under the condition, which is coincidental to the analytical result of primary phase occurrence. The liquid growth mode was found to be subjected to the parabolic rule with quick composition uniformity.