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一种白光LED投射灯组装结构的热分析 被引量：4

Thermal Analysis of White LED Projector Lamp Assembling Structure
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摘要 大功率LED器件的热流密度非常大,实际应用中会因散热结构不善而导致结温高,导致可靠性降低等问题。通过有限元分析的方法设计出一种带有凹槽的铜基板以强化热扩散作用,并对散热通道中的关键环节进行详细分析。 High - Power LED device which has high heat flux, could have high junction temperature due to inefficient heat dissipating structure, hence, low reliability and other problems occur. By using finite element analysis, a method using copper heat spreader with indent in order to enhance heat spreading has been investigated, and key components in the heat dissipating channel have been analyzed in detail.
作者 韩磊磊 王春青 田艳红
机构地区 哈尔滨工业大学现代焊接生产技术国家重点实验室
出处 《电子工艺技术》 2008年第5期254-255,261,共3页 Electronics Process Technology
关键词 LED 热流密度 透射灯 铜基板 LED Heat flux Projector lamp Copper heat spreader
分类号 TN312 [电子电信—物理电子学]
  • 相关文献

参考文献4

  • 1张成敬,王春青.一种高功率白光LED灯具的封装热设计研究[J].电子工艺技术,2007,28(5):257-260. 被引量：10
  • 2Ma Zetao, Wang Xiaojun, Zhu Daqing et al. Thermal anal- ysis and modeling of LED arrays integrated with an inno- vative liquid -cooling module [ C]//6th international con- ference on electronic packaging technology,2005.
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二级参考文献6

  • 1Jen-Hau Cheng,Chun-Kai Liu,Yu-Lin Chao et al.Cooling performance of silicon-based thermoelectric device on high power LED[C].ICT05:24th international conference on thermoelectrics,2005:53-56.
  • 2Kim Lan,Choi Jong Hwa,Jang Sun Ho et al.Thermal analysis of LED array system with heat pipe[J].Thermochimica Acta,vol.455 Apr 1,2007,6th KSTP Symposium:21-25.
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共引文献9

同被引文献21

  • 1胡建人,秦会斌,王卉,崔佳冬,郑梁.我国LED照明工程技术与发展策略研究[J].仪器仪表学报,2007,28(S1):196-199. 被引量：17
  • 2刘向,马小军,臧增辉.LED隧道灯的应用分析[J].照明工程学报,2009,20(S1):80-82. 被引量：4
  • 3陈明祥,罗小兵,马泽涛,刘胜.大功率白光LED封装设计与研究进展[J].半导体光电,2006,27(6):653-658. 被引量：36
  • 4Sheu G J, Hwu F S, Tu S H et al. The heat dissipation performance of LED applied a MHP [ C ]. Fourth international conference on solid state lighting, Proceedings of SPIE,2005,5941:594113.1 - 8.
  • 5Lai Y, Cordero N. Thermal management of bright LEDs for automotive applications [ C ]. Proceedings of the 7th international conference on thermal, Mechanical and multiphysics simulation and experiments in micro - electronics and micro - systems ,2006:390 - 394.
  • 6Zweben C. Ultrahigh - thermal - conductivity packaging materials [ C ]. Semiconductor thermal measurement and management symposium, 2005 : 168 - 174.
  • 7Arik M, Weaver S. Chip scale thermal management of high brightness LED packages [ C ]. Fourth international conference on solid state lighting, proceedings of SPIE, 2004, 5530:214 - 223.
  • 8Shatalov M, Chitnisa A, Yadav P et al. Thermal analysis of flip - chip packaged 280 nm nitride - based deep ultraviolet light - emitting diodes [ J ]. Applied physics letters, 2005,86(20) :201109.1 - 3.
  • 9Hwu F S, Sheu G J, Chen J C. Thermal modeling and performance of LED packaging for Illuminating device [ C ]. Sixth international conference on solid state lighting, pro- ceedings of SPIE,2006,6337 (63371J) :J1 - J7.
  • 10Culham J R,Khan W A ,Yovanovich M Met al. The influence of material properties and spreading resistance in the thermal design of plate fin heat sinks[ J]. Journal of electronic packaging, 2007,129 ( 1 ) :76 - 81.

引证文献4

二级引证文献18

电子工艺技术
2008年 第5期

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