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一款微波双极晶体管的设计和实现 被引量:1

Design and Implementation of a Microwave Bipolar Transistor
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摘要 对双极晶体管结构和关键性能参数进行了研究和设计,并进行了流片测试。介绍了器件工艺步骤及其采用的工艺结构。对器件的特征频率、Gummel曲线、发射极电子和空穴浓度、CE击穿特性模拟、-βIC曲线等关键参数进行了模拟。模拟器件最高特征频率为10 GHz,流片测试最高特征频率为9.5 GHz。 The main structure and key performance parameters of the bipolar transistor were studied and designed, it was taped out and tested. The process steps and the structure were introduced. The frequency characteristics, Gummel curve, electron and hole concentration of emitter, simulation of CE breakdown properties,β-Ic curve, and other key parameters were simulated. The simulation fmax is 10 GHz, and the fmax of the final chip is 9.5 GHz.
出处 《半导体技术》 CAS CSCD 北大核心 2008年第9期780-783,共4页 Semiconductor Technology
基金 聊城大学东昌学院高科技发展项目
关键词 双极晶体管 特征频率 双层多晶硅 增益 bipolar transistor characteristic frequency double-polysilicon gain
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  • 1RUNVANW R, BEAN K E. Semiconductor integrate circuit processing technology [M]. New York : Addision-Wesley Publishing Company, 1990: 108-112.
  • 2IWASAKI N, YANAGIBASHI M, TSUNETSUGU H, et al. Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface [J]. IEEE Transactions on Advanced Packaging, 2001, 24 (4): 429-433.
  • 3ISHISUKA F, IWASAKI N, HIROSE M, et al. A compact MU-interface 2.5 Gb/s optical transmitter module with LD driver IC in L shaped wiring substrate [J]. IEEE Transactions on Advanced Packaging, 1999, 22 (8) : 451-459.
  • 4HIROYUKI M W, HIROAKI A. A complementary bipolar technology for low cost and high performance mixed analog/ digital applications [C]//Proc of Bipolar/BiCMOS Circuit and Technology Meeting. NM, USA, 1996: 185-188.
  • 5LI G P, CHUANG C T, CHEN T C, et al. On the narrow- emitter effect of advanced shallow-profile bipolartransistors [J]. IEEEEDL, 1988, 35 (11): 1942-1950.
  • 6刘其贵,吴金,郑娥,魏同立,何林.多晶硅发射极双极晶体管的工艺设计及计算机模拟[J].电子器件,2002,25(1):97-100. 被引量:4
  • 7余宽豪,刘毓成,陈学良.硅双极型高速工艺和与其相容的硅PIN探测器[J].半导体光电,1995,16(3):265-268. 被引量:3
  • 8YAMAGUCHI T, UPPILI S, LEE J S, et al. Process and device characterization for a 30-GHz fT submicrometer double poly-si bipolar technology using BF2-implanted basewith rapid thermal proeess [J]. IEEE Trans on ED, 1993, 40 (8): 1484-1495.
  • 9刘道广 舒曼 徐婉静 等.基于BiCMOS技术高速数字/模拟转换器.半导体学报,2005,127(1):90-93.
  • 10张万荣,曾峥,罗晋生.Si/SiGe/Si双异质结晶体管异质结势垒效应(HBE)研究[J].电子学报,1996,24(11):43-47. 被引量:12

二级参考文献4

  • 1宋南辛,晶体管原理,1980年
  • 2虞丽生,半导体异质结物理,1990年,66页
  • 3Middelhoek J and Kooy A,Polycrystalline silicon as a diffusion source a nd interconnect layer in I\+2L realizations[J]. IEEE J. Solid-State Circults ,1997;SC-12:135~138
  • 4Okada K Aomura K,Nakamura T,Shiba H,A new polysilicon process for a b ipolar device--PSA technology[J].IEEE Trans. Electron Devices,1979;ED-26:3 85~389

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