摘要
文章概述了信号传输的高频化和高速数字化的发展,趋肤效应越来越严重地影响着电气性能。因此PCB导体的粗糙度必须越来越小,常规的表面氧化技术是越来越不能采用了,必须采用物理化学方法来提高界面的结合力。
The paper describes that the development of signal transmission ofhigh frequence and high-seed digitization.The electric performance is affected by trend-skin effect.Therefore,It is required to surface micro-rough- ness of conductive .It is not used the traditional technology of chemical oxidation.The high- boundaryadberence must be applied with other physical-chemistry.
出处
《印制电路信息》
2008年第10期15-18,共4页
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