摘要
为保证多功能结构内部电子元器件和设备的热可靠性,以及对温度变化的适应能力,利用ANSYS中的热分析模块对多功能结构中心程序器单元寻求最佳的建模及热载荷加载方法,并模拟环境温度条件进行热分析来验证模型设计的合理性,为电子设备的热设计从理论上提供了更加准确的方法。
There are a lot of electron components in the multi - functional structure, so it is necessary to ensure the hot reliability and acclimatization with the temperature change. It uses the thermal analysis module of ANSYS to build the model of the center procedure element sealed in the multi - functional structure. The sim- ulation verifies the real temperature environment and the rationality of the model design. It shows a more accurate way to the thermal design of electronics in theory.
关键词
多功能
热分析
电子设备
Multi- functional
Thermal Analysis
Electronic
