利用半导体集成电路芯片进行微组装

Developing ASIC with Semiconductor Integration Chip Module

利用半导体工艺条件对集成电路芯片进行二次微组装。通过这种技术，可使得电路组装技术来一次变革。

This paper describes how to develop ASIC with SemiconductorIntegration Chip Module.The technology brings some changes in circuit package techonlogies and give a new wag in ASIC (Applied special integration circuit)development.