耐磨胶粘涂层固化残余应力的测试分析

Measurement Analysis of Solidifying Residue Stress of Antiwear Adhesive Coatings

将多根电阻丝平行于界面预埋在耐磨胶粘涂层中不同深度处，通过半桥电路测定了相应深度处涂层的固化残余应力．结果表明，紧接界面处耐磨胶粘涂层的残余应力最高，自界面开始向外约０．５ｍｍ层厚范围内的残余应力逐渐减小，可见涂层的固化残余应力主要来自底材表面对其固化收缩的阻碍效应．用适量的橡胶增韧是减小耐磨胶粘涂层固化残余应力的可行途径．

Many resistance filaments were embedded parallelly in the different depth of the antiwear adhesive coating. The solidifying residue stress at relevant depth of the coating was measured by semibridge circuit. The results showed that the residue stress of antiwear adhesive coating is the highest near the interface. The residue stress gradually decreased from the interface to the outside layer of about 0.5 mm thick, thus the solidifying residue stress of coa ting is resulted from the hinder effect in which substrate surface blocks the solidifying constriction. Increasing the tenacity with moderate amount of rubber is a feasible route for decreasing the solidifying residue stress.