摘要
利用有限元分析软件ANSYS建立了SEL系列微型板-板连接器的试验有限元模型,以连接器簧片的加载压缩和卸载回弹过程为研究对象,分析了簧片完全压缩后的接触法向力及卸载回弹后的回弹高度,与SAMTEC公司的试验数据对比,误差都不超过10%,验证了所建立的簧片有限元模型的可靠性;然后根据实际应用,建立了应用有限元模型并进行仿真分析,分析结果表明:在实际应用中,连接器簧片会产生比试验时更大的塑性变形,回弹高度为0.45 mm,低于试验模型时的回弹高度0.565 mm;最后根据仿真结果进行预测可知,至少要在上PCB板上施加62N的压力才能保证SEL连接器正常工作。
The experimental model of the SEL Microminiature printed board connector was established by finite element analysis software ANSYS, taking the process of loading and unloading the spring leaf on the connector as research subject, normal force of the spring leaf under complete compression and the rebound height when it＇s unloaded were analyzed, and compared with the experimental data of SAMTEC Company. The error is within 10% , which verified the reliability of the finite element model of the spring leaf. Then according to the operating condition, the finite element model of the spring leaf was established and analyzed. The result shows that the spring leaf will have a greater plastic deformation in reality than in the experiment and the rebound height is 0.45mm, lower than the experimental data 0. 565mm. The simulation result is used to predict that a force of at least 62N should be loaded on the upper board to ensure the printed board connector to work well.
出处
《机电元件》
2008年第3期9-15,共7页
Electromechanical Components
