摘要
半导体IC清洗技术由于水溶液的表面张力大而无法进入硅片上器件的狭缝与电路线条间隙中进行清洗,同时不易干燥,且干燥时会造成二次污染,从而使得整个工艺耗水量大且清洗效果不佳。以超临界流体为媒体的清洗技术是克服以上缺点的最佳途径。提出并研制了一种绿色二氧化碳超临界清洗设备,它利用超流体二氧化碳来进行硅片的清洗和无张力的超临界干燥,而且该设备还可以对微细结构进行无粘连的牺牲层释放。设备的成本低,二氧化碳使用量少,并且可以循环使用,属于绿色无污染的新型半导体清洗设备。
In wafer cleaning techniques, conventional cleaning mediums are difficult to go deep into tiny trenches on IC chips due to the surface tension of aqua. The unavoidable desiccation process after wet cleaning would bring granule adsorption and structure distortion or invalidation because of the surface tension caused by the gas/liquid interface. Cleaning technology based on supercritical carbon dioxide is the best way to conquer the mentioned embarrassments. Supercritical carbon dioxide green IC cleaning apparatus could implement zero-surface tension cleaning/desiccation, and sacrificial layer release. The apparatus, a kind of green semiconductor manufacturing equipment, is a low-cost, high-yield rate, and carbon dioxide-cycle apparatus.
出处
《微细加工技术》
EI
2008年第4期50-52,61,共4页
Microfabrication Technology
基金
科学院知识创新工程领域前沿项目资助(5407SF021002)
