355nm和1064nm全固态激光器刻蚀印刷线路板

Laser Etching and Cutting Printed Circuit Board by 355 nm and 1064 nm Diode Pumped Solid State Lasers

采用输出功率8 W的355 nm Nd:YVO_4紫外激光器和50 W的1064 nm Nd:YAG激光器对覆铜板(CCL)和柔性线路板(FPC)进行了刻蚀实验,研究了激光功率密度、重复频率、扫描速度和单脉冲能量等加工工艺参数对刻蚀质量的影响。实验结果表明,由于铜和聚合物材料对紫外激光有更高的吸收率,紫外波段的激光只需要较低的能量就可以将表面铜层刻蚀完全,并且引起的热作用也较小。相反,红外激光加工最大的优势就是对环氧树脂和聚酰亚胺基板的破坏较小,从而适合于表面铜层的去除加工。与此同时,355 nm紫外激光器由于能快速轻易地将厚聚合物基板分离,更适合于印刷线路板(PCB)的切割成型加工。

A 355 nm Nd： YVO4 laser with output power of 8 W and a 1064 nm Nd： YAG laser with output power of 50 W are used for etching the copper clad laminate （CCL） and flexible printed circuit （FPC）. The effects of laser process parameters, such as laser power density, repetition rate, laser scanning speed and single pulse energy, on the etching quality of microstructure are studied in detail. The experimental results demonstrate that the lasers within ultraviolet （UV） range needs less power to etch the copper layer entirely and causes less thermal effect, as copper and polymer have higher absorptivity to UV. On the other hand, the infrared laser is suitable for the ablation of copper layer due to its little damage on polymer. The 355 nm UV laser is suitable for the cutting process of the pinted circut board （PCB） because it can make the facile separation of thick polymer substrates quickly.