一种DSP芯片的失效分析

Validation Analysis Of A DSP Chip

结合一种DSP芯片的失效分析过程、失效改进措施讨论了失效分析的常规手段。在设计中,因为对MCP方式封装、内部多电源、设计中包含多种工艺器件的芯片可靠性设计方法缺乏经验,导致产品失效。在后期经过减小工作电流、防LATCH-UP设计、多电源物理隔离等方法改进设计,并达到设计目的。

Based on analysis of process and improvement of a DSP, this paper gives some conventional means. Because of specific application, a kind of special production is designed. MCP encapsulation, multi-power, complex device make the reliability of design more difficult, and even result in the failure of the first design. Through the improvements such as decreasing electrical current, designing prevention of latch-up, multi-power physical isolation, the design purpose is achieved.