用于柔性覆铜板的耐高温改性环氧树脂胶粘剂的研究

Study of modified epoxy adhesive for FCCLs with high thermal resistance

利用双马来酰亚胺共聚物和端羧基丁腈橡胶共聚物改性环氧树脂,制备了一种可应用于柔性覆铜板的耐高温胶粘剂。使用此胶粘剂制备的柔性覆铜板可通过320℃锡焊浴测试。讨论了两种组分对胶粘剂及相应柔性覆铜板性能的影响。研究显示,双马来酰亚胺的三元共聚物可实现与环氧树脂及低沸点溶剂的互溶,体系的耐热性随双马来酰亚胺改性组分的增加而提高。体系的韧性及粘结强度通过丁腈橡胶改性组分而得到改善。通过形貌研究讨论了丁腈橡胶对胶粘剂体系的增韧效果及增韧机理。

A novel epoxy adhesive for flexible copper clad laminates （FCCLs） with high thermal resistance was prepared with modification by a bismaleimide （BMI） terpolymer and a copolymer including carboxyl-terminated butadiene acrylonitrile （CTBN）. FCCLs made from this modified adhesive can pass a 320℃ soldering test. Effect of the composition on the properties of adhesives and corresponding FCCLs was discussed. The results showed that the BMI terpolymer was dissoluble with both epoxy and low-boiling solvent. Forethermore, the heat resistance was improved with the increasing BMI content. The toughness and bond strength were improved by the CTBN copolymer. The toughening effect and toughening mechanism of CTBN on the modified epoxy was also discussed basing on the morphology investigation.