摘要
分析了高热流密度芯片的冷却要求,对微槽道热沉的优化设计和数值模拟进行了研究.优化结果表明,矩形微槽道热沉的冷却效果最好,微槽道的宽度和槽栅的宽度分别为125μm和50μm,相应的热阻为8.252 K/W.数值模拟结果表明,芯片最高温度为360.482 K,优化的微槽道热沉完全可以满足高热流芯片对温度的要求.
The requirements to cool chips with high heat flux are firstly analyzed. Optimization design and numerical simulation of microchannels heat sink are then studied. It is shown through the results of optimization that rectangle microchannels heat sink has better thermal transfer performance, the width of channel and fin are 125 μm and 50 μm, and the corresponding thermal resistance is 8. 252 K/W. The results of numerical simulation show that the highest temperature of chip is 360. 482 K, which means that the optimized microchannels heat sink can meet the requirements of the chip with high heat flux.
出处
《昆明理工大学学报（理工版）》
2008年第5期24-28,共5页
Journal of Kunming University of Science and Technology(Natural Science Edition)
基金
昆明理工大学博士科研启动基金项目(项目编号:14118056)
昆明理工大学建工学院专项课题项目(项目编号:14078039)
关键词
芯片冷却
微槽道热沉
优化设计
数值模拟
chip cooling
microchannels heat sink
optimization design
numerical simulation
