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日用陶瓷与不锈钢钎焊连接的界面组织与性能分析

Structure and property analysis of brazing interface of domestic ceramic and stainless steel
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摘要 对日用陶瓷进行了化学镀镍,实现了镀镍陶瓷与1Cr18Ni9Ti不锈钢的钎焊连接。借助扫描电镜、能谱分析、X射线衍射分析、压剪试验等分析测试手段,分析了陶瓷/Ni/Sn-3.5Ag/不锈钢在大气环境下,钎焊接头的界面组织结构和接头性能。结果表明,化学镀镍陶瓷/1Cr18Ni9Ti不锈钢接头为多层复合结构,镀镍层与锡基钎料发生界面反应,其界面反应产物为Ni3Sn4金属间化合物及锡基固溶体。当连接温度为300℃,连接时间为5 min时,接头的抗剪强度能达到15.7 MPa。该方法成本低,便于批量生产,拓宽了日用陶瓷的使用范围,具有一定的应用价值。 Domestic ceramics have been chemically plated nickel and the brazing of ceramics plated nickel with 1Cr18Ni9Ti stainless steel was realized.Interfacial structures and properties of ceramic/Ni/Sn-3.5Ag/stainless steel joint in atmosphere were analyzed by some test methods such as scanning electron microscopy(SEM),energy distribution spectrometer(EDS),X-ray diffraction(XRD),shear stress test and so on.The results show that the joint of chemical plated nickel ceramics with 1Cr18Ni9Ti stainless steel is a multilayer compound structure.Plated nickel layer generated interfacial reaction with tin based solder and the productions of interface reaction are Ni3Sn4 intermetallic compound and tin base solution.Shear strengthen of the joint is up to 15.7 MPa when soldering temperature and time are 300 ℃ and 5 min respectively.This method is low cost and convenient for batch production.Thus,it broadens the use range of domestic ceramics and has certain applied value.
出处 《焊接学报》 EI CAS CSCD 北大核心 2008年第10期9-12,共4页 Transactions of The China Welding Institution
基金 国家科技支撑计划项目(2006BAE03B03) 哈尔滨工业大学优秀团队支撑计划项目
关键词 陶瓷 化学镀镍 钎焊 ceramics chemical plating nickel brazing
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参考文献8

  • 1Matsuo Y, Ito M ,Tanignch M. Ceramic-metal joining for automobiles [J]. Industrial Ceramics, 1999, 19(3): 203- 207.
  • 2Zhang C G, Qiao G J, Jin Z H. Active brazing of pure alumina to kovar alloy based on the partial transient liquid phase (PTLP) technique with Ni-Ti interlayer[J]. Joumal of the European Ceramic Society, 2002, 22(13): 2181-2186.
  • 3Thomas P, Niesen, Mark R, De Guire. Review: deposition of ceramie thin films at low temperatures from aqueous solutions[J]. Solid State lonics, 2002, 151(1-4): 61-68.
  • 4Deuis R L, Subramanian C, Yellup J M, et al. Study of eleetroless nickel plating of ceramic particles[ J]. Scfipta Metallurgica at Materialia, 1995, 33(8): 1217-1224.
  • 5邹贵生 吴爱萍 张德库 等.以化学镀Ni—P为先导的陶瓷钎焊[J].中国材料科技与设备,2004,(1):26-31.
  • 6Chang Shouyi, Lin Sujien. Fabrication of SiC reinforced copper matrix composite by electroless copper plating [ J ]. Scipta Materialia, 1996, 35(2): 225-231.
  • 7杨建桥,刘宁,曾华平.陶瓷表面化学镀工艺研究[J].陕西科技大学学报(自然科学版),2000,19(4):11-14. 被引量:6
  • 8Severin J W, Hokke R. The 'adhesion of electroless Ni(P) on alumina ceramic using a vacuum deposited Ti-Pd activator layer[J]. Journal of the Electrochem Society, 1993, 140(7) : 682 - 687.

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