PDMS氧等离子体长效活性表面处理及与Si的键合

Long term active surface modification of Poly(dimethylsiloxane) by O_2 plasma and the PDMS-Silicon hybrid bonding

为了实现室温、常压下聚二甲基硅氧烷(PDMS)与硅的键合,本文利用氧等离子体分别对PDMS、硅进行表面改性处理。考察了等离子体射频电源功率、处理时间、氧气流量对PDMS-硅键合强度的影响。通过优化工艺适当降低PDMS表面被氧化的程度,可使PDMS活性表面的持续时间延长至45分钟,实现了PDMS-硅在室温常压下的永久性键合。通过X-射线光电子能谱(XPS)对改性后PDMS表面化学组分变化的分析,可推断出PDMS表面Si-OH的稳定性是影响键合强度的主要因素。

In this paper the oxygen plasma treatment was introduced to the poly （dimethylsiloxane） （PDMS） and silicon surface modification by which they could be bonded with each other under the room temperature and the atmosphere pressure. The effect of surface modification parameters such as RF power, treating time, and oxygen flux on the bonding strength of the PDMS - Silicon wafer was investigated. By optimizing the surface modification process, the long term active surface of PDMS was obtained. The PDMS and silicon could be bonded with each other 45 minutes after oxygen plasma treatment. After analyzing the changes of the chemical composition in the PDMS sample by XPS, it is concluded that the stability of the Si -OH is the key factors affecting the bonding strength.