ICF靶用泡沫铜的制备与表征

Preparation and characterization of foamed copper for ICF

以次磷酸钠为还原剂的化学镀进行导电化处理，研究了ICF靶用泡沫铜的电沉积工艺。采用扫描电子显微境和X射线衍射仪对制备过程中各阶段泡沫铜的微观结构进行了表征。结果表明：经化学镀后可获得晶粒尺寸小、分布均匀的铜沉积层。电沉积后铜沉积层主要由0．55μm的小颗粒组成，并且出现突出大颗粒的形貌特征。在氢气氛围下，经700℃热处理后，铜颗粒进一步长大，沉积层结晶致密。制备的泡沫铜呈3维网络状结构，分布均匀密度为0．19g／cm^3，孔径分布为400-600μm，孔隙率达97．9％。

The foamed copper was synthesized by electrodeposition technique on the basis of electroless copper plating using sodium hypophosphite as reductant. Micro-structure of foamed copper in different phase was characterized by scanning electron microscope and X-ray diffraction instruments. Small grain size and homogeneous copper in the foam silk were obtained by electroless plating. The electrodeposited copper was composed of 0.55 μm granules and there were some big granules in the middle of the electrodeposed copper silk. After heat treatment at 700 ℃, the granules crystal in the silk were dissolved, and the copper grains were bigger. Three-dimensional network foamed copper with compact crystal, density of 0.19 g/cm^3 , pore diameter ranged from 400 to 600μm, and porosity of 97.9% was prepared.