电子封装热管理的热电冷却技术研究进展

Research progress on thermoelectric cooling technology applied in electronic packaging thermal management

电子封装器件中芯片的散热问题一直是制约其发展的瓶颈。综述了芯片的产热特征、散热需求与散热方式。对热电冷却(TEC)技术在芯片散热系统上的应用进行分析,指出了其不足之处与特有的优势。对热电冷却技术在芯片热管理方面应用研究的现状与进展进行了总结评述。

The question of heat dissipation of chips in electronic packaging device is the obstruction in its development. The heat producing characteristics, heat dissipation requirement and mode of electronic chip were reviewed. The applications of thermoelectric cooling （TEC） technology in electronic chip heat dissipation system were analyzed and pointed out the disadvantages and advantages. Furthermore, the present situation and research progress of thermoelectric cooling technology applied in electronic packaging thermal management were summerised and reviewed.