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双面贴装电路板上BGA焊点的潜在失效机理 被引量：2

Potential Failure Mechanism of BGA Solder on Double-Sided Board
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摘要 采用双面贴装回流焊工艺在FR4基板表面贴装Sn3.0Ag0.5Cu(SnAgCu)无铅焊点BGA器件,通过对热应力加速实验中失效的SnAgCu无铅BGA焊点的显微结构分析和力学性能检测,研究双面贴装BGA器件的电路板出现互连焊点单面失效问题的原因,单面互连焊点失效主要是由于回流焊热处理工艺引起的。多次热处理过程中,NiSnP层中形成的大量空洞是导致焊点沿(Cu,Ni)6Sn5金属间化合物层和Ni(P)镀层产生断裂失效的主要因素。改变回流焊工艺是抑制双面贴装BGA器件的印制电路板出现互连焊点单面失效问题的关键。 BGA Ball-Grid-Array packages with Sn3.0Ag0.5Cu lead-free solder were assembled on FR4 substrate by reflow soldering technology. The mierostructure and mechanical properties of lead-free Sn3.0Ag0.5 Cu BGA solder were studied, which were failure after thermal stress tests. And the failure mechanism of specifically side solder on double-side board was discussed. The reflow soldering technology results in the failure of specifically side solder. The voids produced during annealing process in the NiSnP layer caused the fracture between （Cu, Ni）6Sn5 intermetallic compound and Ni （P） finishes. The change of reflow soldering technology is the key issue to restrain the failure of specifically side solder on double-side board assembled BGA package.
作者 陆裕东 何小琦 恩云飞 王歆 庄志强
机构地区 信息产业部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室 华南理工大学材料学院特种功能材料教育部重点实验室
出处 《半导体技术》 CAS CSCD 北大核心 2008年第11期952-955,共4页 Semiconductor Technology
基金 国家部委基金项目 信息产业部电子第五研究所科技发展基金(XF0726130)
关键词 锡银铜 无铅 焊点 球栅阵列 失效 SnAgCu lead-free solder BGA failure
分类号 TN407 [电子电信—微电子学与固体电子学] TN41 [电子电信—微电子学与固体电子学]
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参考文献12

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半导体技术
2008年 第11期

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