摘要
随着封装体积的减小,半导体分立器件引线的外露部分也越来越小,这给引线温度的测试带来了巨大挑战。以封装外形为SOD-123FL的小电流整流二极管为例,介绍了结到引线的热阻和结到环境的热阻的测试方法。通过测量焊接于引线端部的小尺寸二极管芯片以及被测样品在不同温度下的热敏电压,实现了对小封装器件的引线温度和二极管本身结温的精密测量。
As the reduce of package size, the outer-lead of semiconductor device is getting much more shorter, which lead to the great challenges for the measurement of the lead temperature. A small current rectifier diode （packaging appearance SOD-123FL） was taken as an example to introduce the measuring methods of the thermal resistance both junction to lead terminal and junction to the ambient. By measuring the thermal sensitive voltage under the different temperatures for both the small size of the diode chip （soldered to the lead terminal） and the DUT, the precision measurement for the small outline device lead temperature and its junction temperature are achieved.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第11期1032-1035,共4页
Semiconductor Technology
关键词
热阻
结温
小封装器件
二极管
封装尺寸
thermal resistance
junction temperature
small outline device
diode
package size
