亚硫酸盐电镀Au-Cu合金工艺研究

Study on the Process of Au-Cu Alloy Electroplating in Sulfite Bath

实验了一种无氰亚硫酸盐电镀金-铜合金工艺,利用X-射线荧光光谱仪、金相显微镜、显微硬度计等检测了镀层的金含量、表面形貌及硬度等性能。结果表明,镀液分散能力和深镀能力良好,镀层呈金黄色外观,硬度高,结合力较好,节约了黄金,适宜做装饰性镀层。

A cyanide-free sulfite process for electroplating Au-Cu alloy was studied. The gold component, morphology and micro hardness of the coating were studied systematically by means of X-ray fluorescence, microscope, micro hardness tester. The results showed that the bath had well throwing power and covering power, the plating coating had golden-color, high hardness, good adhesion, good corrosion resistance properties. Co-deposition of Cu with Au saved gold. The plating coating of this process can be used as decorative coating.