干簧继电器簧片Au-Rh配套电镀工艺研究

Investigation on Plating Process of Electrodeposited Gold-Rhodium on the Cooperating Contact of a Reed Switch

研究了电镀液组分和工艺控制参量对Fe－50％Ni合金簧片An－Rh配套镀层显微组织、性能的影响。工艺优化结果表明：采用2#镀铑液，控制镀轮时的电流密度0．6A／dn2、时间8min、温度50℃，可获得显微组织呈颗粒状均匀致密分布、无明显龟壳状裂纹的优良Au－Rh配套镀层。

The influence of the composition and concentrations of plating bath as well as process-ing variables on micrographs and properties of Au-Rh deposition on the Fe-50%Ni alloy base isinvestigated. It is shown that better Au-Rh deposition with well distributed fine grain mi-crostructure and without obvious tortoise-shell-like crack can be obtained by using No. 2 Rhodi-um's plating bath with processing variables conducted at 0. 6 A/dm2, 8min, 50℃.