世界覆铜板新品种新技术赏析(1)——日立化成薄封装基板用环境友好低热膨胀材料MCL-E-679GT(上)

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(1)——Low CTE Environmental Friendly Material MCL-E-679GT of Hitachi Chemical for Thin Package Substrates(A)

文章介绍了日立化成PCB用基板材料的发展路线,分析了日立化成最新推出的薄封装基板用环境友好低热膨胀材料MCL-E-679GT的材料设计和日立化成的填料界面控制系统,综述了MCL-E-679GT的性能特点。

In the paper, roadmap for printed circuit board material of Hitachi Chemical was introduced. The material design and filler interface control system of low CTE environmentally friendly MCL-E-679GT used in thin package substrate were analyzed. At the same, the performance of MCL-E-679GT was reviewed.