功率器件金刚石薄膜用热沉的传热模型及模拟

The heat conduction model and simulating of diamond thin films as heat sink for power electric devices

目的对金刚石薄膜在改善电力电子器件热特性的应用进行初步的探索。方法将金刚石薄膜用于电力电子器件(横向二极管)的热沉,建立横向二极管的导热模型,采用Microsoft VisualBasic 6.0程序设计语言对导热模型进行计算机模拟仿真。结果当金刚石薄膜的厚度达到约50μm以上时,所获得的散热效果较显著,但并不是随着金刚石薄膜厚度的增加,器件的温度随之线性降低,当h>100μm以后,温度降低变缓。结论金刚石薄膜作为电力电子器件的导热层能明显地降低器件的温升。

Aim To study the thermal performance of diamond thin films as heat sink in terms of the electric power devices.Methods The diamond film is grown on the horizontal power diodes as their heat sink and the heat conduction model of the device is built and simulated with computer using the Microsoft Visual Basic 6.0 program language.Results The working temperature of the diode can be greatly reduced as the thickness of the diamond film reaches 50 μm.Whereas the temperature does not decrease linearly with the increasing of the thickness of the diamond film,and the reducing of the temperature becomes slow when the thickness of the film is above 100 μm.Conclusion The working temperature of the electric power devices is reduced notably owing to the high thermal conductivity of the diamond film.