摘要
采用真空电弧炉熔铸+喷铸成形技术,以Cu-0.8Cr-0.04RE(55wt%La+45wt%Ce)为名义成分,通过熔铸过程中原位自生成的Cr碳化物制备了颗粒增强Cr3C2/Cu复合材料;研究了该材料的显微组织、力学性能和电学性能。结果表明:经冷变形和时效处理后该材料的显微组织特征为以稳定的等轴晶α-Cu相为基,其上弥散分布着Cr3C2颗粒;经适当的冷变形+时效处理后,该材料抗拉强度664.5MPa,显微硬度220HV100,电导率82.5%IACS,软化温度550℃,可满足超大规模集成电路引线框架材料所要求的主要性能指标。
Taking Cu-0.8Cr-0.04RE （55wt% La＋45wt%Ce） as the nominal ingredient, Cr3CJCu composite was prepared by vacuum arc furnace and spray-formation. The microstructure, mechanical and electrical properties were studied. The results show that the microstructure characteristic after cold deformation and aging treatment is the structure of taking a stable equiaxed grain α-Cu phase as matrix, on which there are dispersion distribution Cr3C2 particles. The material has the tensile strength of 664.5 MPa, microhardness of 220 HV100, conductivity of 82.5% IACS, softening temperature of 550 ℃, and can meet requested typical properties of ultra integrated circuit lead frame materials.
出处
《热加工工艺》
CSCD
北大核心
2008年第20期8-11,共4页
Hot Working Technology
基金
教育部长江学者与创新团队发展计划资助项目(IRT0730)
