无铅电子组装材料——导电胶的研究进展

Recent Advances of Conductive Adhesives as New Lead-free Electronic Assembly Materials

电子产品小型化、便携化、集成化的趋势和人类环保意识的增强,使传统的电子组装材料已不能满足现实的需要。导电胶作为一种无铅、绿色、环境友好的新型电子组装材料,正日益成为电子工业中组装材料的主流。该文对导电胶的组成、分类、导电机理、导电胶的导电填料、聚合物粘料、添加剂等基本组成材料和导电胶性能研究进展作了综述。引用文献43篇。

The tendency of miniaturization, portability and integration of electronic products, and the strengthening of human awareness of environmental protection, have put forward many requirements that the traditional electronic assembly materials can not meet. As a new type of ＂ lead - free, green, environmentally-friendly＂ electronic assembly materials, conductive adhesives are increasingly becoming the mainstream of assembly materials in the electronics industry. The composition, classification,and conductive mechanism of conductive adhesives are briefly overviewed; the recent research progress of conductive fillers, polymer viscosity materials, additives, and other essential component materials, as well as the properties of conductive adhesives are reviewed. 43 references are cited.