BGA芯片视觉检测定位算法

Vision Detection and Locating Algorithm of BGA Package Based on Hough Transform and Point Pattern Matching

针对高速高精度贴片机中BGA芯片视觉检测定位问题,深入分析了BGA芯片焊球排布的整体特征,在已有成果的基础上提出一种基于Hough变换和点模式匹配相结合的新算法。试验结果表明一定程度上弥补了已有算法的不足,同时也大大提高了识别系统的速度和精度。

Aiming at the vision detection and locating problems of BGA chip in the high speed and high precision SMT placement, a new algorithm based on hough transform and point pattern matching is made according to existing achievement after the overall characteristics of BGA chip - ball arrangement is deeply analyzed. The result of actual running demonstrates that it, certain extent, compensates for the deficiencies of the existing method, but also greatly enhances the speed and accuracy of the whole identifica- tion system.