摘要
针对高速高精度贴片机中BGA芯片视觉检测定位问题,深入分析了BGA芯片焊球排布的整体特征,在已有成果的基础上提出一种基于Hough变换和点模式匹配相结合的新算法。试验结果表明一定程度上弥补了已有算法的不足,同时也大大提高了识别系统的速度和精度。
Aiming at the vision detection and locating problems of BGA chip in the high speed and high precision SMT placement, a new algorithm based on hough transform and point pattern matching is made according to existing achievement after the overall characteristics of BGA chip - ball arrangement is deeply analyzed. The result of actual running demonstrates that it, certain extent, compensates for the deficiencies of the existing method, but also greatly enhances the speed and accuracy of the whole identifica- tion system.
出处
《电子工艺技术》
2008年第6期311-313,327,共4页
Electronics Process Technology
基金
广东省粤港关键领域重点突破项目(项目编号:No.20041A01
No.TC05B372-1)
广东省科技厅重大科技攻关专项(项目编号:No.2004A10403001)
广东高校科技成果转化重大项目(项目编号:No.cgzhzd0403
No.cgzhzd0402)