摘要
无铅化电子组装中,由于原材料的变化带来了一系列工艺的变化,随之产生许多新的焊接缺陷。针对电迁移和K irkendall空洞等缺陷进行了产生机理分析,并给出了相应的解决措施。
Changes of material bring a series of process problems in lead - free electronic assembly with occurrence of new solder defects. Analyze causes and give out solution of solder defects for electronic migration and kirkendall voids etc.
出处
《电子工艺技术》
2008年第6期365-367,369,共4页
Electronics Process Technology
关键词
无铅
焊点
缺陷
电迁移
柯肯达尔空洞
Lead - free
Solder Joint
Defect
Electronic migration
Kirkendall void
