基于低功耗CPLD的超声测厚仪

Application of Low Power Dissipation CPLD in the Ultrasonic Thickness Gage

以ispMach 4000系列的低功耗复杂可编程逻辑器件(CPLD)为核心,设计了一种超声测厚仪.基于CPLD硬件平台,根据模块化设计的思想,采用VHDL编程实现超声测厚仪的数据采集处理模块.该设计具有低成本、低功耗和配置灵活的特点.实验结果证明能有效提高测量精度.

An ultrasonic thickness power dissipation CPLD. In this the concepts of modularization, gage is designed using the ispMach 4 000 family paper, with the hardware the data collection and platform base on CPLD processing modules of lOW and the ultrasonic thickness gage are realized using VHDL. It has advantages such as low cost, low power dissipation and flexible configuration.