期刊文献+

国家同步辐射实验室的LIGA技术研究及应用 被引量:6

Research and Application of LIGA Process at Nationol Synchrotron Radiation Laboratory
下载PDF
导出
摘要 LIGA技术是一种可以利用多种材料获得大高宽比微结构的微细加工方法。介绍了LIGA技术的原理和国家同步辐射实验室LIGA试验线站的参数。详细给出NSRL近年来在同步辐射光刻、微电铸和微塑铸等LIGA技术方面的研究进展,同时给出其在微惯性器件和微流体器件等LIGA应用方面的研究进展。分析LIGA技术研究及应用的发展现状以及所遇到的困难,结合同步辐射光刻的特点,提出LIGA应用的一些展望。 LIGA(Lithographie galvanformung and abformug) process is a micro fabrication method that can use various materials to obtain high aspect ratio microstructures. The principle of LIGA techniques and the parameters of LIGA experimental station at NSRL are introduced. The recent progresses in the research of LIGA techniques at NSRL, such as synchrotron radiation lithography, mi- cro-electroforming, micro-molding, and the application of LIGA techniques, such as micro-inerial devices and micro-fluidic devices, are presented in detail. The development status of research and application of LIGA techniques and the problems encountered are analyzed. Some of the prospects of LIGA application are put forward by combining the features of synchrotron radiation lithgraphy.
作者 刘刚 田扬超
出处 《机械工程学报》 EI CAS CSCD 北大核心 2008年第11期47-52,共6页 Journal of Mechanical Engineering
基金 国家自然科学基金资助项目(10375058)。
关键词 LIGA技术 微塑铸 微流体器件 LIGA technique Micro-molding Micro-fluidic devices
  • 引文网络
  • 相关文献

参考文献18

  • 1BECKER E, EHRFELD W, HAGMANN P, et al. Fabrication of microstructures with high aspect ratios by LIGA process [J]. Microelectron. Eng., 1986, 4: 35-56.
  • 2BLEY P. The LIGA process for fabrication of 3D microscale structures[J]. Interdisc. Sci. Rev., 1993, 18(4): 267-272.
  • 3LIU Gang, TIAN Yangchao, XIONG Ying, et al. Fabrication of 3D photonie crystal by deep x-ray lithography [J]. SPIE, 2006, 6110: 61100R.
  • 4LIU Gang, HUANG Xinlong, XIONG Ying, et al. Fabricating HARMS by using megasonic assisted electroforming[C]// HARMST'07, Besancon, France, 2007: 23-24.
  • 5GUO Yuhua, LIU Gang, TIAN Yangchao. Investigation on overplating high-aspect-ratio microstructure [J]. SPIE, 2006, 6109: 61090M.
  • 6HECKELE M, SCHOMBURG W. Review on micro molding of thermoplastic polymers[J]. J. Micromech.Microeng., 2004, 14: R1-R14.
  • 7WORGULL M, HECKELE M. New aspects of simulation in hot embossing[J]. Microsyst. Technol., 2004, 10: 432-437.
  • 8GUO Yuhua, LIU Gang, XIONG Ying, et al. Study of the demolding process--implications for thermal stress, adhesion and friction control[J]. J. Micromech. Microeng., 2007, 17: 9-19.
  • 9GUO Yuhua, LIU Gang, XIONG Ying, et al. Study of hot embossing using nickel and Ni-PTFE LIGA Mold inserts[J]. J. MEMS, 2007, 16 (3): 589-597.
  • 10GUO Yuhua, LIU Gang, ZHU Xuelin, et al. Analysis of the demolding forces during hot embossing[J]. Microsyst Technol, 2007, 13: 411-415.

同被引文献76

引证文献6

二级引证文献49

;
使用帮助 返回顶部