摘要
合成了一种新型含联苯结构的环氧树脂,并以DDS为固化剂,比较了它与双酚A环氧树脂,邻甲酚醛环氧树脂的耐热性及耐湿性。结果表明,含联苯结构的环氧树脂具有更好的耐热性,同时在耐湿性方面也有很大改进,有利于应用在电子封装材料领域。
A novel diphenyl-containing epoxy resin was synthesized and cured with 4,4-diamino diphenyl sulfone, the heat-resistant and moisture-resistant properties were investigated and compared with bisphenol A epoxy resin and phenolic epoxy resin. The results showed that the diphenyl-containing epoxy resin had some progresses in the aspects of heatresistant and moisture-resistant properties
出处
《化工新型材料》
CAS
CSCD
北大核心
2008年第11期49-50,61,共3页
New Chemical Materials
关键词
联苯
环氧树脂
耐热性
耐湿性
diphenyl, epoxy resin, heat-resistant, moisture-resistant
