摘要
采用三种带有氰基的苯并噁嗪（Ben）与环氧树脂（E51）共混,制备了Ben/E51共混体系。用红外光谱研究了Ben/E51共混体系的固化行为。利用TGA和DMA研究了Ben/E51固化物的耐热性能和动态力学性能,结果显示,共聚体系的分解温度与用酸酐或胺固化的环氧树脂相比提高了70-80℃,玻璃化转变温度提高了30-70℃。Ben/E51共混体系的力学性能和介电性能比苯并噁嗪树脂有明显提高。
Three kinds of phenylnitrile functional benzoxazine （Ben） were mixture with epoxy （ES1） to prepare the Ben/ES1 blends and the curing behavior of them was investigated by FTIR. The thermal stability and dynamic mechanical properties of cured blends were studied by TGA and DMA. The results showed that the decomposition temperature of cured blends went up by 70-80℃, and the Tg went up by 30-70℃ compared to epoxy resin cured with anhydride or aniline. The flexural strength, toughness and dielectric property improved apparently compared to polybenzoxazine.
出处
《化工新型材料》
CAS
CSCD
北大核心
2008年第11期81-83,93,共4页
New Chemical Materials
关键词
苯并噁嗪
环氧树脂
氰基
耐热性能
benzoxazine, epoxy resin, phenylnitrile function, thermal stability
