期刊文献+

光弹法实测正交异性双材料界面裂纹断裂参数 被引量:2

DETERMINATION OF FRACTURE PARAMETERS FOR INTERFACE CRACK IN ORTHOTROPIC BI-MATERIALS BY PHOTOELASTIC METHOD
下载PDF
导出
摘要 采用光弹贴片法实测正交异性双材料界面裂纹尖端区域的应力应变场,进而求出界面裂纹的断裂力学参量.将正交异性双材料板加工成拉伸试件,在聚碳酸酯贴片的单侧表面镀金属铝膜,以提高贴片的反射效率.沿贴片后的双材料界面预制裂缝,逐渐加大载荷,得到一系列清晰的等差线条纹图.利用正交异性双材料界面裂纹尖端应力分量表达式计算出应力强度因子.实验表明,光弹贴片法可有效地分析正交异性双材料界面裂纹问题. The stress-strain field of interface crack tip in orthotropic bi-materials is determined by photoelastic coating in this paper, and the fracture mechanics parameters for interface crack are derived. Orthotropic bimaterials panel is made into a tension specimen, and metallic-aluminum coating is plated in the surface of unilateral polycarbonate coating to enhance the reflectivity of polycarbonate coating. Then the load along the interface prefabricated cracks of bi-materials is gradually increased, a series of clear equi-difference lines can be observed. Stress intensity factor can be calculated by using stress component expressions for interface crack in orthotropic bi-materials. The testing-result indicates that photoelastic coating can effectively analyze the problem for interface crack in orthotropic bi-materials.
出处 《力学与实践》 CSCD 北大核心 2008年第6期56-59,80,共5页 Mechanics in Engineering
关键词 光弹贴片法 正交异性双材料 界面裂纹 应力强度因子 photoelastic coating, orthotropic bi-mat, erials, interface crack, stress intensity factor
  • 相关文献

参考文献4

二级参考文献27

共引文献23

同被引文献6

引证文献2

二级引证文献6

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部