摘要
采用光弹贴片法实测正交异性双材料界面裂纹尖端区域的应力应变场,进而求出界面裂纹的断裂力学参量.将正交异性双材料板加工成拉伸试件,在聚碳酸酯贴片的单侧表面镀金属铝膜,以提高贴片的反射效率.沿贴片后的双材料界面预制裂缝,逐渐加大载荷,得到一系列清晰的等差线条纹图.利用正交异性双材料界面裂纹尖端应力分量表达式计算出应力强度因子.实验表明,光弹贴片法可有效地分析正交异性双材料界面裂纹问题.
The stress-strain field of interface crack tip in orthotropic bi-materials is determined by photoelastic coating in this paper, and the fracture mechanics parameters for interface crack are derived. Orthotropic bimaterials panel is made into a tension specimen, and metallic-aluminum coating is plated in the surface of unilateral polycarbonate coating to enhance the reflectivity of polycarbonate coating. Then the load along the interface prefabricated cracks of bi-materials is gradually increased, a series of clear equi-difference lines can be observed. Stress intensity factor can be calculated by using stress component expressions for interface crack in orthotropic bi-materials. The testing-result indicates that photoelastic coating can effectively analyze the problem for interface crack in orthotropic bi-materials.
出处
《力学与实践》
CSCD
北大核心
2008年第6期56-59,80,共5页
Mechanics in Engineering
关键词
光弹贴片法
正交异性双材料
界面裂纹
应力强度因子
photoelastic coating, orthotropic bi-mat, erials, interface crack, stress intensity factor