微流体芯片仿生可逆封装方法

A Biomimetic Reversible Sealing Method for Micro Fluidic Chip

当2片聚二甲基硅氧烷接触时,黏附阵列中每根绒毛通过侧面与另一层的一根或多根绒毛的侧面接触,形成可逆封装。根据Baney-Hui的弹性圆柱体接触模型,得到了单根绒毛黏附力表达式。接着分别讨论了黏阵列的单面和双面接触形态以及相应封装强度。结果表明,双面接触形态的封装强度更大,最后用模版法制造了黏附阵列。

A reversible sealing is achieved through the hairs of the adhesive array contact with one or more hairs of the other array,when the two polydimethylsiloxane layers con- tact.Based on the Baney-Hui's elastic cylinder contact model, the expression of the adhesive force is obtained,Then the single face,dual faces contact configuration and the corre- sponding sealing strength of the adhesive array are analyzed. The results show that the sealing strength of the dual faces contact configuration is more.The adhesive array is fabrica- ted through mold fabrication method finally.