焊膏印刷领域中的最新热门先进技术

Popular and Advanced Technique in The Field of Solder-paste Printing

焊膏印刷是SMT生产中关键工序之一,其控制直接影响着组装板的质量。本文简要介绍了当前焊膏印刷领域中的一些热门先进技术以及工作原理,例如流变泵、焊膏喷印和3D AOI等等。这些新技术的出现极大地促进了表面贴装技术的发展,并有效控制焊膏印刷质量。可以确信这些新技术将会被更多地应用于电子组装生产上以保证电子组装质量。

Solder-paste printing plays an important part in SMT production, and affects the quality of assemblies, the article simply introduces popular and advanced technique and the theory in the field of solder paste printing, for example, Proflow,JetPrinting and 3D AOI, etc. It is said that the new technologies have developed and innovated SMT since they were appeared and effectively control quality of solder paste printing. It is believed that the new technologies will more be adopted to guarantee the quality of electronics assembly in electronics assembly.