低温共烧陶瓷技术现状与趋势

The Technique Status and Trend of LTCC

综述了低温共烧陶瓷技术进展现状与应用市场前景,指出了集成电路封测产业在进入后摩尔时期面对高密度组装的挑战中,应对多层布线集成封装中LTCC技术的发展趋势。

This paper overviews the present status of low temperature co-fired ceramic technique progression and its market application prospects, point outIC package and test industry reply the challenge of high density packaging during the post - Moore era, LTCC in which integrate packaging technique developing trend.