摘要
利用生物浸出液的反萃液进行电沉积铜的研究,采用高倍扫描电镜及能谱分析等手段,在无添加剂条件下,发现用不可溶阳极得到的沉积物比用铜作可溶阳极得到的沉积物表面形貌更规则、致密;用石墨作不可溶阳极,得到沉积物中铜的含量较高,没有发现硫,氧含量比用可溶阳极得到的电沉积铜要低得多;在不可溶电沉积条件下,发现添加剂对电沉积铜有利,以胶和硫脲作添加剂得到的阴极铜沉积物呈树枝状,结晶致密、表面光滑,而以EDTA作添加剂得到的铜沉积物呈块状,表面松散、不光滑。
The copper deposition is studied with de-extraction liquor from bioleaching solution in this paper. The results of SEM and EDX for electrolysis sample show that thiourea and glue make the grains more fine and compact on deposit surface, and more obviously gain the texture and growing structure type of copper deposit under the condition of indiscerptible anode than under the condition of soluble anode. The copper electrodeposition on the indiscerptible anode with graphite has higher copper content and less oxygen than on the soluble anode without sulfur found. It is found that it's helpful to add additives to copper electrodeposition on the indiscerptible anode. The copper deposition is dendrite with the additives of thiourea and glue, which is fine and compact, whereas, the copper deposition is nubby with the additives of EDTA, whose surface is incompact rough.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2008年第12期118-121,共4页
Materials Reports
基金
国家973项目(2004CB619200)
中南大学博士后基金
关键词
生物浸出液
铜电沉积
硫脲
骨胶
EDTA
机理
bioleaching solution,copper electrodeposition,thiourea,glue, EDTA,mechanism