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铅系PTCR生产过程中产生斑点的原因浅析

Reason analysis of formed spot in production process for Pb system PTCR
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摘要 采用SEM及EDS,观察和分析了PTC热敏陶瓷(PTCR)生产过程中,瓷体表面斑点的微观形貌及微区化学成分。结果表明:异常区域中,w(Pb)较正常区域高0.1%以上,该区域晶粒尺寸为10~20μm,明显大于正常区域晶粒(5~10μm),且其斑点处的室温电阻值大于正常区域。对其形成原因进行分析,并提出了相应的解决措施。 SEM and EDS were used to observe and analyze the spot micro-morphology of ceremic body surface and chemical composition in microarea. The results indicate that the grain size of abnormal area is bigger (10-20 μm) than normal area (5-10 μm); the w(Pb) in this area is also above 0.1% than the w(Pb) of normal area; and the room temperature resistance value of spot area is larger than norma area. Its formed reasons were analyzed and some overcoming measures were proposed.
出处 《电子元件与材料》 CAS CSCD 北大核心 2008年第12期22-24,共3页 Electronic Components And Materials
关键词 铅系PTCR 产生斑点原因 解决措施 Pb system PTCR formed reasons of the spot overcoming measures
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