光电互联组装工艺流程设计

Design of Assembly Flow for Optoelectronic Interconnect

光电互联技术是解决电子设备向高频率、高速度、高集成发展瓶颈的关键技术,而组装工艺技术在光电互联中处于重要地位。针对光电互联要求高精度定位、高兼容性的特点,在分析光电互联技术原理的基础上,从新的角度提出光电互联的组装工艺难题,提出组装工艺解决方案,设计关键组装工艺流程。分析表明,通过控制组装工艺关键技术参数,设计合理的组装工艺流程,能够解决所提出的新组装工艺难题,满足基于光波导的光电互联技术的组装要求。

The optoelectronic interconnect is the key technology to solve the bottleneck of high frequency, high velocity, high integration for electronic equipments. The assembly technology plays an important role in optoelectronic interconnection. Aiming at the characteristics of high precision and compatibility require- ment for optoelectronic interconnection, the assembly problems are presented from a new point of view in optoelectronic interconnection based on analyzing the principle of optoelectronic interconnection. An effective assembly solution is proposed, and a key assembly flow is designed. The analysis and research results show that the assembly problems can be solved and the assembly requirement in optoelectronic interconnection an ke satisfied bv controlling assemblv kev narameters and designing reasonable flow.