摘要
BGA是现代组装技术的新概念,它的出现促进了SMT(表面贴装技术)与SMD(表面贴装元器件)的发展和革新,并将成为高密度、高性能、多功能及高I/O数封装的最佳选择。本文将结合实际工作中的一些体会和经验,就BGA焊点的接受标准、缺陷表现及可靠性等问题展开论述,特别对有争议的一种缺陷空洞进行较为详细透彻的分析,并提出一些改善BGA焊点质量的工艺改进的建议。
BGA is a new concept of contemporary assembly technology. BGA has developed and innovated the SMT/SMD since it appeared. It is believed that BGA will be the best choice of the IC with density, high performance, multiple function and high I/Os. The acceptable criterions, solder defects and reliability of BGA solder joint are discussed here. Especially a disputed defect behavior void will be analyzed in detail. Some suggestions of improving BGA solder joint quality is also discussed.
出处
《中国集成电路》
2008年第12期52-57,共6页
China lntegrated Circuit
