基于压电驱动的电子芯片散热器试验研究

Experimental study on heat sinks of electronic chips based on piezo actuator

电子芯片的散热一直是影响计算机技术发展的关键问题,液冷方式中采用微喷射结构散热器是满足电子芯片高效散热的有效方法。设计了利用叠堆式压电驱动器散热系统,利用压电陶瓷产生的中低频振动,实现对电子芯片冷却器散热板的脉动喷射,进行了同参数下微喷射散热器与微槽道散热器散热对比试验研究。试验表明,利用叠堆式压电陶瓷可以更有效的满足散热器槽道及微喷微小尺度的流体驱动问题。微喷射散热器具有优良的稳态下的散热性能和瞬态下的储热性能。

Heat removal of electronic chips is crucial for the development of computer technology. Micro jet cooling heat sink is an effective method for Heat removal of electronic chips in liquid cooling pattern. The cooling system by use of Piezoelectric sicack actuator was designed. Cooling fluid was pulse injected to the cooling board by means of low frequency vibration of the piezoelectric ceramic actuators. The contrast experiment between micro jet cooling heat sink and micro groove cooling heat sink was completed. Test results show that Piezoelectric stack actuator can provide enough driving force for the cooling liquid of two heat sinks. Micro jet cooling heat sink has fine heat of both the steady state and the transient process of jump heating.