面向芯片封装的冗余驱动T型XY运动系统的研制

T-type XY Motion Control System Redundantly Driven for Semiconductor Packaging

面向芯片封装设备对高速高精度的需求,提出了一种多直线电机冗余驱动的T型XY运动系统。T型XY工作台以单直线电机作为Y轴动力源,双直线电机作为X轴动力源,并配以高分辨率、高精度的位置检测元件和控制系统,共同组成T型运动系统。叠加式的机械结构设计使得工作台尺寸小、质量轻、刚度高;多电机的冗余驱动为系统提供了更大推力以提高设备的加速度。通过扫频试验,建立了系统的实验模型,在实验模型基础上设计了控制器并进行了实验研究。该运动系统目前实现了最大速度0.65m/s,最大加速度9.25g,及微米级定位精度的性能指标,能够适应当前IC封装业发展对高速高精度的要求。

A T-type XY motion control system redundantly actuated by multi-linear motors was presented, which can be used in semiconductor packaging. T-type motion control system consists of one linear motor used to drive Y axis, two linear motors used to drive X axis, stacked mechanism, high resolution and high precision position sensors and control system. The stacked mechanism conduces to small dimension, light load and high stiffness. The higher acceleration was achieved since the multi-linear motors can supply with more power. The controller was designed and demonstrated based on the experimental model come from sweep test. The experiment result shows that the T-type motion eonlrol system has the maximum acceleration capabilities in 9. 25g, the maximum velocity capabilities in 0. 65nv/s, positioning accuracy at the micron level, which meets the hight requirement of semiconductor packaging.