无钎剂加压钎焊接头特性

Characteristics of Fluxless Press-Solderde Joints

阐述了微电子器件表面组装无钎剂加压钎焊新方法。利用研制的加压钎焊设备进行引线焊接并对试件进行了拉剪试验。试验结果表明，加压钎焊接合部强度高于普通软钎焊接合部强度的２倍。采用热电偶实时测量焊接劈刀温度，并利用电子探针对接合部元素的分布进行了分析。分析结果表明，接合部产生高熔点合金化层以及组织细化是提高接合部强度的主要原因。

A fluxless soldering technology-press-doldering has been developed,which is suitable for the surface mount devices.The self-made press-soldering equipment has been used for soldering the leads,and the tensile shear experiment has been made on these test samples.The result of the experiment showed that the strength of the press-soldered joint is twice as much of the ordinary soldered joint.The thermocouple has been used to measure the real time temperature of soldering electric thermo-couple and the electron probe has been used to analyze the element distribution of element of the joints.The result of the analysis showed that fining and alloying the structure of the joints are the primary reason to enhance the strengty of the joints.