摘要
为了降低镀金溶液中有害金属杂质的共沉积和提高镀金层质量,对镀金液中重金属杂质的分析方法进行了概述。
In order to decrease the codeposition of harmful metallic impuities in gold plating solutions and improve quality of gold plating,a variety of traditional methods to analyze the heave metallic impurities in gold plating solutions are summarized and reviewed in this paper.
出处
《电子工艺技术》
1998年第1期24-27,共4页
Electronics Process Technology