化学机械抛光的研究进展

Advancement of chemical mechanical polishing

化学机械抛光简称CMP技术是迄今唯一的可以提供整体平面化的表面精加工技术,可广泛用于集成电路芯片、计算机硬磁盘、微型机械系统等表面的平坦化。介绍了半导体加工领域CMP技术的特点,重点叙述了CMP技术的发展历程、设备特性、研磨抛光耗材和应用领域的技术现状,指出CMP急待解决的技术和理论问题,并对其发展方向进行展望。

Chemical mechanical polishing （CMP） is the only finish machining technique up to date for surface global planarization, which has been widely used for the manufacturing of integrated circuits （ IC ） , hard disk, micro - electro mechanical systems, etc. The introduction mainly focused on the recent developments of CMP technology in semi -conductor fabrication, especially on the CMP equipment characteristics, progress of CMP, consumables and new application. The progress and problems of CMP are reviewed in the paper, and the future prospect of CMP is outlined.