摘要
传统的FR-4材料制造成本低、加工性好,但不适于无铅制程或在用于无铅制程时有较高的爆板风险;而目前市面上的无铅FR-4则存在制造成本高、在PCB加工时难以进行冲孔和钻孔等缺点。基于以上情况,本文介绍一种新型低成本的、PCB加工性良好的、适用于无铅制程的FR-4覆铜板材料。
The manufacturing cost of conventional FR-4 material is low and its processability is very good, but it is not compatible for lead-free solder process, or it has greater potential delamination risk when used in lead-free solder process. Meanwhile, those lead free compatible FR-4 materials currently available at market have the following disadvantages： high manufacturing cost, difficult to be punched and large drilling loss in PCB process. In view of these, a novel low cost and lead-free compatible FR-4 CCL with excettent PCB processabitities is introduced in this paper.
出处
《覆铜板资讯》
2008年第6期19-25,共7页
Copper Clad Laminate Information
