非金属材料表面激光诱导化学局域镀覆金属(铜、镍)的研究

Experimental Study of Laser-Induced Localized Chemical Depositions of Copper and Nickel on Surfaces of Nonmetallic Materials

利用514．5nmAr+激光及1079．5nmNd：YAP激光作诱导光源，有机玻璃、环氧树脂板作为基体，研究了激光功率、辐照时间、镀液组份、浓度对激光诱导化学局域镀覆金属铜、镍的影响规律，探讨了激光作用的物理机制。利用扫描电子显微镜及轮廓仪分析了镀斑形成过程、微观形貌、厚度分布。结果表明：与普通化学镀相比，激光诱导的镀覆速度要高2～3个数量级，镀层表面平滑、颗粒大小均匀、规则、分布致密。镀斑的厚度在横向上呈类高斯分布。

The influences of laser power, irradiating time, composition and concentration of plating solution on the localized chemical deposition of copper and nickel have been studied by using 51 4. 5 um Ar+ laser and 1079. 5 nm Nd: YAP laser as inducing light source, and polymethyl methacrylate and epoxy resin as substrates. The physical mechanism of laser action have been discussed. The growth progress and the micrographs of the deposited spot have been analyzed by SEM and profilemetry. The results show that the depositon induced by laser have many advantages compared with common chemical plating, such as the smooth surface, regular shape and size, even and compact distribution. The plating speed is 2～ 3 order of magnitude higher than that of common chemical plating, and the thickness of deposited spots haS a Gaussian-like distribution in transverse direction.