摘要
半导体封装过程中,热应力是导致封装过程中器件分层的主要原因之一,主要研究如何降低环氧模塑料(Epoxy Molding Compound,EMC)的应力,以及降低应力对环氧模塑料分层的影响。通过对多组不同原材料比例做试验,并在试验数据的基础上进行分析对比,合适的填料含量和应力吸释剂可以有效降低环氧模塑料的应力,从而减少分层或避免分层的发生。在SOIC20L上通过JECDECMSL/260C的可靠性考核,没有任何分层。总之,EMC7(D应力吸释剂)是最好的,在SOIC20L上能够通过MSL3/260C的可靠性考核,达到0分层。
Thermal stress in a semiconductor package is one of the major reason causes delamination after stress testing. To reduce total stress in a package, the reduction of stress of epoxy molding compound was studied in this paper. Different raw material was applied into a standard formulation. Properties was compared. Stress index was calculated base on the test data.It was found with lower stress index of EMC, delamination to lead frame can be eliminated. All the finished material was molded on a SOIC 20L test vehicle and soaked with a Jedec MSL 3 condition. Delamination was checked after soaking and reflows. It was found with lower stress index ofEMC, delamination to lead frame can be eliminated.
出处
《电子工业专用设备》
2008年第12期15-19,共5页
Equipment for Electronic Products Manufacturing
