摘要
纳米W-Cu复合粉末具有大的比表面积和高的烧结活性,可制备各种致密度高、性能优良的W-Cu复合材料,因而在电子封装和微电子信息工业中越来越受到重视。本文综述了近几年国内外纳米W-Cu复合粉末的发展现状,详细介绍和评价了几种纳米W-Cu复合粉末的制备方法。
W-Cu nanocomposite powder which can be made high density and great performance W-Cu composite material have been payed more attention in electronics and micro-electronics industry due to its high specific area and great sintering activity. This paper review the latest development of W-Cu nanocomposite powder in china and abroad .Several preparation methods of W-Cu nanocomposite powder have been introduced and evaluated.
出处
《硬质合金》
CAS
北大核心
2008年第4期252-256,共5页
Cemented Carbides
基金
国家自然基金50874122
国家十一五"863"重点项目2006AA03A213
