摘要
介绍了国内外邦定设备及生产工艺，对存在的问题进行了分析并给出了以下改进措施：加入W=0．1％～0．2％的粉体改进剂以提高上粉率，将温度控制在邦定工艺温度段以延长处理时间，筛分邦定工艺处理后的物料，结块时切断电源后手工清理等。
The equipments and processes of bonding mixing technology at home and abroad were introduced. The existing problems were analyzed and some improvement measures were given as follows： improving the powder utilization with 0.1%-0.2% （mass fraction） powder modifier addition, extending the treatment time by controlling the temperature in process range, screening powders after bonding mixing, and manual finishing after power cut-off in case of powder caking.
出处
《电镀与涂饰》
CAS
CSCD
2008年第12期55-57,共3页
Electroplating & Finishing
关键词
粉末涂料
邦定混合
效应颜料
改进措施
powder coating
bonding mixing
effect pigment
improvement
